Circuit substrate material, circuits comprising the same,...

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Noninterengaged fiber-containing paper-free web or sheet...

Reexamination Certificate

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C428S209000, C428S425800, C428S425900, C428S465000, C174S258000

Reexamination Certificate

active

07022404

ABSTRACT:
An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate is formed from a thermosetting composition comprising a polybutadiene or polyisoprene resin; an optional, functionalized liquid polybutadiene or polyisoprene resin; an optional butadiene- or isoprene-containing copolymer; an optional low molecular weight polymer; an optional curing agent; a cross-linking agent; a particulate fluoropolymer; and about 20 to about 50 percent by weight, based on the total weight of the thermosetting composition, of a magnesium hydroxide having a low ionic content. Use of magnesium hydroxide allows the composition to attain a high level of flame retardancy without use of halogenated flame retardants, while maintaining good moisture absorption and other physical properties.

REFERENCES:
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patent: 5223568 (1993-06-01), Landi et al.
patent: 5416143 (1995-05-01), El Sayed et al.
patent: 5571609 (1996-11-01), St. Lawrence et al.
patent: 5972811 (1999-10-01), St. Lawrence et al.
patent: 6048807 (2000-04-01), Landi
patent: 6476138 (2002-11-01), Sato et al.
patent: 6528559 (2003-03-01), Nakacho et al.

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