Circuit substrate including anodization control means

Electricity: electrical systems and devices – Safety and protection of systems and devices – Circuit automatically reconnected only after the fault is...

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Details

257350, 257351, 257390, 257410, 257469, 257900, 257 59, 257 72, 437 71, 437913, H01L 2701, H01L 2976, H01L 2904

Patent

active

057037442

ABSTRACT:
A circuit substrate includes a plurality of semiconductor devices including electrodes, a wiring having a plurality of branched portions and mainly formed of a metal material, a terminal for applying a voltage to the wiring to anodize the branched portions, and an anodization controller for controlling degrees of anodization of the branched portions. The branched portions serve as the electrodes of the semiconductor devices. The terminal is connected to the wiring.

REFERENCES:
patent: 4839002 (1989-06-01), Pernick et al.
patent: 5485019 (1996-01-01), Yamazaki et al.

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