Circuit substrate having high thermal conductivity

Details Circuit substrate having high thermal conductivity Circuit substrate having high thermal conductivity

1985-02-27

1987-04-21

Swisher, Nancy

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428698, 428699, 428901, 501 96, 501 98, C04B 3552, C04B 3558, B32B 1504, B32B 516

Patent

active

046596119

ABSTRACT:
A high thermal conductivity circuit substrate is provided comprising a sintered aluminum nitride ceramic substrate consisting essentially of one member selected from the group of yttrium, the rare earth metals and the alkali earth metals and an electrically conductive thick film paste for a conductive layer formed on the substrate.

REFERENCES:
patent: 3607613 (1971-09-01), Passmore et al.
patent: 3922475 (1975-11-01), Manasevit
patent: 4070518 (1978-01-01), Hoffman
patent: 4072771 (1978-02-01), Grier, Sr.
patent: 4219448 (1980-08-01), Ross
patent: 4273822 (1981-06-01), Bube
patent: 4435513 (1984-03-01), Komeya et al.
patent: 4457861 (1984-07-01), Des Marais, Jr.
patent: 4478785 (1984-10-01), Huseby et al.
patent: 4519966 (1985-05-01), Aldinger et al.
Werdecker et al., "Aluminium Nitride-An Alternative Ceramic Substrate for High Power Applications in Micro Circuits", IEEE, May 1984, pp. 402-406.

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