Circuit substrate having ceramic multilayer structure containing

Details Circuit substrate having ceramic multilayer structure containing Circuit substrate having ceramic multilayer structure containing

1987-11-12

1989-01-24

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361401, H01G 410, H05K 118

Patent

active

048004596

ABSTRACT:
A circuit substrate (1) comprises a ceramic laminated structure (10) which has a plurality of ceramic layers (2-7) including ceramic layers (3-6) having cavities (44-49). Chip-like electronic components such as a laminated ceramic capacitor (26, 27) and a resistor (28) are received in the cavities. The chip-like electronic components are formed with external terminal electrodes (29-34) respectively. Conductors (15-20) are formed in through holes (35-43) provided in the ceramic layers and interfaces between adjacent pairs of the ceramic layers, to be connected to the external terminal electrodes. The external terminal electrodes are prepared from metal which is mainly composed of at least one of nickel, copper and palladium, and the conductors are prepared from metal which is mainly composed of copper.

REFERENCES:
patent: 2777110 (1957-01-01), Kodama
patent: 3699394 (1972-10-01), Schuler
patent: 3784878 (1974-01-01), Neu
patent: 4142203 (1979-02-01), Dietz
patent: 4225468 (1980-09-01), Donohue
patent: 4288841 (1981-09-01), Gogal
patent: 4349862 (1982-09-01), Bajorek et al.
patent: 4451869 (1984-05-01), Sakabe et al.
patent: 4535350 (1985-08-01), Goodrich et al.
patent: 4567542 (1986-01-01), Shimada et al.
patent: 4585580 (1986-04-01), Donohue
patent: 4608592 (1986-08-01), Miyamoto
Electronic Ceramics, vol. 16 (74) Mar. 1985.
Electronic Ceramics, vol. 16 (75) May 1985.

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