Circuit substrate for mounting a semiconductor element

Details Circuit substrate for mounting a semiconductor element Circuit substrate for mounting a semiconductor element

1992-07-24

1994-11-08

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174258, H05K 109

Patent

active

053629264

ABSTRACT:
A circuit substrate for mounting a semiconductor element comprises an aluminum-copper clad foil laminated on a metallic base plate by interposing an insulating layer, wherein the roughness in average of the surface in contact with the insulating layer of the aluminum-copper clad foil is in a range of from 0.5 .mu.m to 50 .mu.m.

REFERENCES:
patent: 3328275 (1967-06-01), Waterbury
patent: 4521476 (1985-06-01), Asai et al.
patent: 4987677 (1991-01-01), Tanaka
patent: 5049221 (1991-09-01), Wada
European Patent Application 0339881.
Patent Abstracts of Japan, vol. 11, No. 244 (E-530), Aug. 8, 1987, & JP-A-62-054-947, Mar. 10, 1987, Kawanobe Sunao, "Metal Strip for Lead Frame".
Patent Abstracts of Japan, vol. 11, No. 41 (E-478), Feb. 6, 1987, & JP-A-61-207-044, Sep. 13, 1986, Shoji Takashi, et al., "Formation of Circuit of Thermal Spraying Substrate".
Patent Abstracts of Japan, vol. 9, No. 8 (E-289), Jan. 12, 1985, & JP-A-59-158-544, Sep. 8, 1984, Hirai Hideo, et al., "Circuit Substrate and Manufacture Thereof".

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