Circuit substrate device, method for producing the same,...

Details Circuit substrate device, method for producing the same,... Circuit substrate device, method for producing the same,...

2006-11-21

2006-11-21

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000, C438S118000

Reexamination Certificate

active

07138294

ABSTRACT:
A circuit substrate device composed of a circuit unit2and a multi-layer wiring substrate3in which a pattern conductor of the circuit unit2may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit2having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate3having a connecting terminal portion14exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate3so that the pattern conductor is connected to the connecting terminal portion14. The dummy substrate is then removed to give a structure comprised of the circuit unit2formed on the multi-layer wiring substrate3. The pattern conductor of the circuit unit2is freed of warping or inundations along the direction of thickness of the circuit unit2.

REFERENCES:
patent: 4306925 (1981-12-01), Lebow et al.
patent: 6294407 (2001-09-01), Jacobs
patent: 6521530 (2003-02-01), Peters et al.
patent: 6737300 (2004-05-01), Ding et al.
patent: 2002/0171157 (2002-11-01), Soga et al.

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