Circuit substrate comprising nitride type ceramics, method for p

Details Circuit substrate comprising nitride type ceramics, method for p Circuit substrate comprising nitride type ceramics, method for p

1988-03-29

1989-11-28

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428698, 428901, 428704, 428472, 4284722, 428699, 428701, 174 685, B32B 900

Patent

active

048837040

ABSTRACT:
One aspect of the present invention is directed to an aluminum nitride ceramic substrate which comprises an aluminum nitride ceramic sheet and a conductive metallized layer formed thereon. The metallized layer comprises molybdenum and/or tungsten and contains a compound containing yttria and alumina in the vicinity of the interface between the aluminum nitride ceramic sintered sheet and the conductive metallized layer.

REFERENCES:
patent: 4659611 (1987-04-01), Iware et al.
patent: 4740403 (1988-04-01), Oomen et al.
patent: 4770953 (1988-09-01), Horiguchi et al.

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