Circuit substrate, circuit-formed suspension substrate, and prod

Details Circuit substrate, circuit-formed suspension substrate, and prod Circuit substrate, circuit-formed suspension substrate, and prod

1997-02-13

1999-01-12

Cooney, Jr., John M.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428323, 428458, 428901, B32B 2718

Patent

active

058585184

ABSTRACT:
A circuit substrate having an insulating layer comprising a polyimide resin on a metal foil substrate, wherein the polyimide resin is a polyimide resin obtained by the reaction of

REFERENCES:
patent: 5470943 (1995-11-01), Sakata et al.
patent: 5605763 (1997-02-01), Yusa et al.
patent: 5665802 (1997-09-01), Maki et al.

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