Circuit substrate and thermal printing head using the same

Details Circuit substrate and thermal printing head using the same Circuit substrate and thermal printing head using the same

1987-07-09

1989-02-21

Broome, H.

Electric heating

Heating devices

Combined with diverse-type art device

338307, 420457, H05B 100

Patent

active

048067253

ABSTRACT:
A circuit substrate, such as a thermal printing head, having electrodes made of a material suitable for soldering. The electrode to be soldered, at least in part, is composed of an alloy of Ni and Cu, whose composition ranges from 65 mol % Ni - 35 mol % Cu to 75 mol % Ni - 25 mol % Cu.

REFERENCES:
patent: 2090946 (1937-08-01), Kurtz et al.
patent: 2150094 (1939-03-01), Bieber
patent: 2234955 (1941-03-01), Bieber et al.
patent: 3282689 (1966-11-01), Santner
patent: 4195937 (1980-04-01), Baran
Sharp Ghio Technical Bulletin, No. 33, pp. 55-60; 1985.

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