Circuit substrate and method for forming bumps on the circuit su

Details Circuit substrate and method for forming bumps on the circuit su Circuit substrate and method for forming bumps on the circuit su

1987-02-24

1988-11-22

Kittle, John E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428220, 428543, 428901, 430311, 430313, 430318, 430319, 430394, 1566591, 1566611, 156901, B32B 300, G03C 500

Patent

active

047865458

ABSTRACT:
A circuit substrate for use in manufacturing integrated circuit devices by the strip-support method in connection with a semiconductor element having conductive pads. The circuit substrate includes a base layer, a conductive circuit layer supported on the base layer for mechanically and electrically coupling to the conductive pads of a semiconductor device. The conductive circuit layer includes a plurality of finger leads with a bump at the end of each finger lead for mechanically and electrically coupling to one of the conductive pads. The coupling surface of each bump has a roughness in a range between 5 and 20 microns. The inherent roughness of the bumps can be augmented by plating the bumps with nickel and gold. A method for forming bumps on the conductive layer of a circuit substrate for attachment of the circuit substrate to conductive pads of a semiconductor element is also provided. The method includes coating a front and a back surface of the conductive layer with photo-resists. Then the photo-resists on both surfaces of the conductive layer are patterned by simultaneous exposure and development. Next, both surfaces of the conductive layer are half-etched. Then, one of the surfaces of the conductive layer is coated with a protective resist and the other surface of the conductive layer is etched. Finally, the photo-resist and protective resist are removed.

REFERENCES:
patent: 4151543 (1979-04-01), Hayakawa et al.
patent: 4259436 (1981-03-01), Tabuchi et al.
patent: 4564582 (1986-01-01), Miyazaki
patent: 4587185 (1986-05-01), Miyazaki
patent: 4587199 (1986-05-01), Bennett

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