Circuit substrate and method for fabricating the same

Details Circuit substrate and method for fabricating the same Circuit substrate and method for fabricating the same

2006-11-21

2006-11-21

Enad, Elvin (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S741000, C361S730000, C174S262000, C174S260000, C174S258000

Reexamination Certificate

active

07139176

ABSTRACT:
A circuit substrate including a silicon substrate with through-holes formed therein, conducting films formed on the inside walls of the through-holes, and an organic resin film formed on the surface of at least one side of the silicon substrate and covering at least parts of the through-holes. Accordingly, even in a case where the through-holes formed, micronized at a small pitch, the substrate does not lower the mechanical strength. Thus, a circuit substrate which is applicable to high-density packaging can be provided.

REFERENCES:
patent: 5266748 (1993-11-01), Kawakami et al.
patent: 6074567 (2000-06-01), Kuraishi et al.
patent: 6323439 (2001-11-01), Kambe et al.
patent: 6359790 (2002-03-01), Meyer-Berg
patent: 6414248 (2002-07-01), Sundstrom
patent: 6430059 (2002-08-01), Hung et al.
patent: 6497943 (2002-12-01), Jimarez et al.
patent: 6700077 (2004-03-01), Chiang
patent: 6713184 (2004-03-01), Ferencz et al.
patent: 6717070 (2004-04-01), Watanabe
patent: 6992379 (2006-01-01), Alcoe et al.
patent: 2002/0038725 (2002-04-01), Suzuki et al.
patent: 2-39569 (1990-02-01), None
patent: 6-53414 (1994-02-01), None
patent: 6-169064 (1994-06-01), None
patent: 11-251320 (1999-09-01), None

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