Circuit substrate and method for fabricating inductive circuit

Details Circuit substrate and method for fabricating inductive circuit Circuit substrate and method for fabricating inductive circuit

2008-07-18

2011-11-01

Hoffberg, Robert J (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S250000, C361S761000, C029S825000, C029S829000, C029S847000, C336S137000, C336S200000

Reexamination Certificate

active

08049116

ABSTRACT:
A circuit substrate including a laminated layer, an embedded electronic device, at least a circuit structure, and a solder mask layer is provided. The embedded electronic device is disposed within the laminated layer. The circuit structure is disposed on a surface of the laminated layer and is connected between a reference plane and the embedded electronic device. In addition, the solder mask layer is disposed on the surface of the laminated layer and exposes a portion of the circuit structure. The circuit structure has a specific layout by which a circuit trace with an adjustable length can be formed by disconnecting or connecting the exposed portion of the circuit structure.

REFERENCES:
patent: 4035695 (1977-07-01), Knutson et al.
patent: 4494100 (1985-01-01), Stengel et al.
patent: 5239289 (1993-08-01), Ferraiolo et al.
patent: 5517756 (1996-05-01), Shirai et al.
patent: 6114938 (2000-09-01), Iida et al.
patent: 6369683 (2002-04-01), Iida et al.
patent: 6369684 (2002-04-01), Iida et al.
patent: 6498556 (2002-12-01), Iida et al.
patent: 6624735 (2003-09-01), Iida et al.
patent: 7071806 (2006-07-01), Masu et al.
patent: 2009/0019692 (2009-01-01), Huang et al.

Affiliated with

Also associated with

Rating

Circuit substrate and method for fabricating inductive circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit substrate and method for fabricating inductive circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit substrate and method for fabricating inductive circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4294303