Circuit substrate and electronics computer, using sintered glass

Details Circuit substrate and electronics computer, using sintered glass Circuit substrate and electronics computer, using sintered glass

1995-08-08

1998-10-20

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174255, 174261, 174256, 174258, 361792, 428901, H05K 111, H05K 103, H05K 116

Patent

active

058256326

ABSTRACT:
Ceramic circuit substrate which is sintered at 900.degree. to 1,050.degree. C. and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing are provided by using a glass with a softening point of 850.degree. to 1,100.degree. C., that is, a glass having a composition included in an area in FIG. 1 (triangular composition diagram of SiO.sub.2 --B.sub.2 O.sub.3 --R.sub.2 O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively as raw material.

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patent: 5362551 (1994-11-01), Okamoto et al.
patent: 5407473 (1995-04-01), Miura et al.

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