Circuit substrate and electronic apparatus, fabrication...

Details Circuit substrate and electronic apparatus, fabrication... Circuit substrate and electronic apparatus, fabrication...

2006-08-22

2008-12-23

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C361S795000

Reexamination Certificate

active

07468490

ABSTRACT:
A circuit substrate comprises a lamination of plural resin insulation films and includes, on a surface and in an interior of the circuit substrate, plural interconnection layers. One of the plural resin insulation films is formed on a first conductor pattern constituting one of the plural interconnection layers in such a manner that a bottom principal surface of the resin insulation film makes a contact with a surface of the first conductor pattern, the resin insulation film including an opening defined by a sloped surface and exposing the first conductor pattern at the bottom principal surface. A ceramic high-K dielectric film is formed at a bottom of the opening in contact with the surface of the first conductor pattern, wherein there is formed a second conductor pattern constituting one of the plural interconnection layers on the resin insulation film so as to cover the sloped surface and in contact with a surface of the ceramic high-K dielectric film.

REFERENCES:
patent: 2006/0138591 (2006-06-01), Amey et al.
patent: 2007/0090511 (2007-04-01), Borland et al.
patent: 2007/0230089 (2007-10-01), Tsai
patent: 2008/0142253 (2008-06-01), Salama et al.
patent: 2003-133507 (2003-05-01), None

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