Circuit substrate

Details Circuit substrate Circuit substrate

1993-05-03

1994-12-13

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174254, 361774, 361777, H05K 102

Patent

active

053731140

ABSTRACT:
A circuit substrate comprises, on a surface of a substrate, an electronic-part packaging section extending longitudinally and a plurality of conductive patterns extending in parallel relation to each other along the electronic-part packaging section. The conductive patterns and electronic parts are electrically connected to each other by wire bonding. The conductive patterns are drawn around in a stairway manner at an area or region of the wire bonding, to form a plurality of stairway-like steps. The stairway-like steps are so formed as to extend in consideration of overhang of bonding wires. The stairway-like steps are so arranged as to extend slightly obliquely with respect to the electronic-part packaging section such that the stairway-like steps are located substantially at the same distance with respect to the electronic-part packaging section.

REFERENCES:
patent: 2963535 (1960-12-01), Wegener et al.
patent: 3221095 (1965-11-01), Cook
patent: 3499098 (1970-03-01), McGahey et al.
patent: 3727169 (1973-04-01), Henschen et al.
patent: 4580193 (1986-04-01), Edwards

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