Wave transmission lines and networks – Long line elements and components
Patent
1997-03-28
1999-03-23
Ham, Seungsook
Wave transmission lines and networks
Long line elements and components
333219, 333247, 174250, 361734, H01P 308, H05K 100
Patent
active
058865977
ABSTRACT:
A resonant via-type connection between layers of a multilayer support structure having, at predetermined RF frequencies, a very low, effectively short circuit impedance. The resonant vias utilize the inductance of a via post by forming it into a resonant circuit with a capacitance at the via's distal end coupled to another conductor. A plurality of resonant vias can be formed having respective plurality of resonant frequencies to form a wideband connection. The capacitances at the vias' distal ends coupling to another conductor can be formed to resonate with the total series inductance of the via post and of wire connections to an attached device.
REFERENCES:
patent: Re35064 (1995-10-01), Hernandez
patent: 4706162 (1987-11-01), Hernandez et al.
patent: 4739448 (1988-04-01), Rowe et al.
patent: 5023579 (1991-06-01), Bentivenga et al.
patent: 5272590 (1993-12-01), Hernandez
patent: 5304967 (1994-04-01), Hayashi
patent: 5354599 (1994-10-01), McClanahan et al.
patent: 5396397 (1995-03-01), McClanahan et al.
patent: 5446430 (1995-08-01), Yamanaka et al.
patent: 5451917 (1995-09-01), Yamamoto et al.
patent: 5475264 (1995-12-01), Sudo et al.
patent: 5499445 (1996-03-01), Boyle et al.
patent: 5509200 (1996-04-01), Frankeny et al.
patent: 5528209 (1996-06-01), Macdonald et al.
patent: 5635767 (1997-06-01), Wenzel et al.
patent: 5689216 (1997-11-01), Sturdivant
patent: 5723823 (1998-03-01), Bell
patent: 5726863 (1998-03-01), Nakayama et al.
Ham Seungsook
Virginia Tech Intellectual Properties Inc.
LandOfFree
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