Electricity: electrical systems and devices – Miscellaneous
Patent
1982-09-13
1984-09-18
Kucia, R. R.
Electricity: electrical systems and devices
Miscellaneous
361393, 361395, 361412, 361416, H05K 114
Patent
active
044727658
DESCRIPTION:
BRIEF SUMMARY
DESCRIPTION
1. Technical Field
This invention pertains to the mechanical arrangement of related multiple electrical circuits.
2. Background Art
U.S. Pat. No. 3,206,648 discloses a quasi-three-dimensional structure in which electronic components are connected between metallic X and Z axis combs and Y axis buses in spaced relation.
However, elongated boxes (47) are provided between each tier through which the many inter-connecting wires must be run.
A large number of insulating spacers (30) are used to support the combs and the buses. "Tridimensional conductors functions are presented in a bidirectional manner." (col 2, lines 40-1).
Mother-boards are not mentioned, nor are zero-insertion-force connectors; these having been invented a few years after the filing dated of this invention. Obviously, there is no suggestion of the coordinated connection of zero-insertion-force connector pins from one side of a mother-board to the other.
In U.S. Pat. No. 3,206,648 the signal paths are strictly two-dimensional, with control circuits only in the third dimension.
U.S. Pat. No. 3,377,515 discloses a two-tier cage for holding a plurality of circuit cards and making connections thereto. A plurality of finger pairs (30) on the cage make contact to each circuit card. The circuit arrangement is two-dimensional and there is no mention of any scheme for connecting the finger pairs, one to another.
DISCLOSURE OF INVENTION
A three-dimensional mechanical disposition of an electrical circuit having plural inputs and plural outputs. The structure is arranged in tiers. It is comprised of circuit-carrying cards disposed on edge between intervening mother-boards. Zero-insertion-force (ZIF) connectors upon the mother-boards accept the circuit-carrying cards, making selected contacts with the circuits thereof.
Conductive pins of the ZIF connectors make common point electrical connections through the mother-boards. ZIF connectors of alternate tiers are orthogonally arranged.
The structure eliminates wire connections between tiers.
BRIEF DESCRIPTION OF DRAWINGS
FIG. 1 is a perspective elevation view of a three-tier three-dimensional circuit structure.
FIG. 2 is a simplified diagram of the structure of FIG. 1 showing how the connection scheme is implemented.
FIG. 3 is an enlarged exploded detail of the three-dimensional circuit structure, illustrating the orthogonal aspect.
FIG. 4 is a plan view of pin connection intersections.
FIGS. 5, 6 and 7 are plan views of alternate modes of intersection connections.
FIG. 8 is a schematic diagram of a routing type switcher that can be embodied in the three-dimensional circuit structure of this invention.
BEST MODE FOR CARRYING OUT THE INVENTION
The essential aspect of the invention is shown in FIG. 4 where the pin connections through a mother-board are shown as black diamond shapes. These are electrically conductive areas that connect plural pins.
An illustrative complete structure is shown in FIG. 1.
In FIG. 1, numeral 1 identifies the top or primary tier of plural circuit cards.
Similarly, numeral 2 identifies a middle or secondary tier of plural circuit cards. Note that these are orthogonally (at right angles) arranged with respect to the disposition of the primary cards.
Further, numeral 3 identifies the lower or tertiary tier of plural circuit cards. These are orthogonally arranged with respect to the disposition of the secondary cards. This results in a parallel arrangement with respect to the primary cards.
Mother-board 4 is disposed between the primary and secondary tiers, and mother-board 5 between the secondary and tertiary tiers. These two mother-boards are spaced apart in parallel relation by mechanical support 6, which may also be reproduced at the front and back sides of these mother-boards for mechanical rigidity. This has not been shown in FIG. 1 for sake of clarity.
Atop mother-board 4 are first plural, spaced, parallel-related zero-insertion-force (ZIF) elongated electrical connectors 7, 7', 7", 7.sup.n ; for example, eight of them. These each support and make electrical
REFERENCES:
patent: 2701346 (1955-02-01), Powell
patent: 2799837 (1957-07-01), Powell
patent: 2955236 (1960-10-01), Luhn
patent: 3206648 (1965-09-01), Jordan, Jr. et al.
patent: 3355722 (1967-11-01), Grubb et al.
patent: 3660803 (1972-05-01), Cooney
patent: 3668476 (1972-06-01), Wrabel et al.
patent: 4179724 (1979-12-01), Bonhomme
patent: 4220382 (1980-09-01), Richie et al.
Hughes Electronic Devices Corporation
Kucia R. R.
Lubcke Harry R.
LandOfFree
Circuit structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Circuit structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-796709