Circuit property measurement method

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Calibration

Reexamination Certificate

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C324S754090, C324S095000, C324S1540PB

Reexamination Certificate

active

11055698

ABSTRACT:
In a high frequency circuit property measurement method, prior to property measurements of a high frequency circuit with RF measurement probe heads, RF measurement probe heads are calibrated using a calibration pattern comprising a signal line having a characteristic impedance and extending on a dielectric substrate, a first GND pad having one end disposed close to and at an interval from a first end of the signal line, a second GND pad having one end disposed close to and at an interval from a second end of the signal line, and a conductor electrically coupling the first GND pad to the second GND pad.

REFERENCES:
patent: 5194932 (1993-03-01), Kurisu
patent: 5594358 (1997-01-01), Ishikawa et al.
patent: 6555907 (2003-04-01), Katoh
patent: 5-152395 (1993-06-01), None
patent: 10-285023 (1998-10-01), None
patent: 2000-101309 (2000-04-01), None
patent: 2003-4474 (2003-01-01), None
Carlton, D.E. et al.; “Microwave Wafer Probing Achieves On-Wafer Measurements Through 18 GHz”, Reprinted from the May 1985 edition ofMSN&Communications Technology.

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