Circuit pattern forming apparatus using MU-STM

Details Circuit pattern forming apparatus using MU-STM Circuit pattern forming apparatus using MU-STM

1990-05-01

1993-06-01

Berman, Jack I.

Radiant energy

Irradiation of objects or material

Irradiation of semiconductor devices

250306, 2504923, G01N 2300

Patent

active

052162540

ABSTRACT:
An apparatus for forming a predetermined circuit pattern on a circuit substrate by using a .mu.-STM write head, the .mu.-STM write head comprising a write head substrate having a flat surface, a plurality of micro chip electrodes formed upright on the flat surface of the write head substrate and constituting a .mu.-STM, a level of a distal end of each of the chip electrodes being set to be constant, and scanning means for scanning the micro chip electrodes on the circuit substrate by moving the micro chip electrodes and the circuit substrate relative to each other in two-dimensional directions.

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Chang et al., "Nanostructure Technology" IBM J. Res. Develop vol. 32 No. 4 Jul. 1988.
Applied Physics Letter, vol. 51, No. 4, Jul. 27, 1987, pp. 247-249, article entitled "Direct Writing of Submicron Metallic Features with a Scanning Tunneling Microscope" by R. M. Silver, et al.

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