Circuit pattern formation device and method of forming...

Radiation imagery chemistry: process – composition – or product th – Electric or magnetic imagery – e.g. – xerography,... – Electrostatic image transfer

Reexamination Certificate

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C430S034000, C430S045200

Reexamination Certificate

active

08039182

ABSTRACT:
An object is to improve the adhesion strength between a circuit pattern and its substrate without increasing the resistance value of the circuit pattern in preparation of a circuit pattern holding substrate. A circuit pattern formation device100forms, after forming a precursor circuit-pattern12in the surface of a dielectric thin film body4, a circuit pattern14onto a target substrate23from the dielectric thin film body. After forming an electrostatic latent image2in the upper surface of the dielectric thin film body, the electrostatic latent image is exposed using an exposure unit3to prepare a pattern. A development apparatus7supplies a conductive particle dispersion solution6to this pattern to form a precursor circuit-pattern. By energizing the circuit pattern holding substrate8, in which an adhesive layer22is formed, the precursor circuit-pattern is temporarily transferred to the circuit pattern holding substrate. The transferred precursor circuit-pattern is heated using the heater13to form a circuit pattern. The circuit pattern and the adhesive layer are released from the circuit pattern holding substrate, thereby transferring to the target substrate.

REFERENCES:
patent: 5641597 (1997-06-01), Ushio et al.
patent: 7556850 (2009-07-01), Ikishima et al.
patent: 2005/0153249 (2005-07-01), Yamaguchi et al.
patent: 57-36890 (1982-02-01), None
patent: 2004-247572 (2004-09-01), None
patent: 2005-203396 (2005-07-01), None
patent: 2005-347571 (2005-12-01), None

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