Circuit packaging for millimeter-wave components

Details Circuit packaging for millimeter-wave components Circuit packaging for millimeter-wave components

1998-04-06

2000-05-09

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438118, 438121, H01L 2144

Patent

active

060603429

ABSTRACT:
A module for a millimeter-wave component having environmentally sensitive components, such as with chip and wire technology, is described which does not require that the entire module be hermetically sealed against the outside elements in order to protect the environmentally sensitive component. A cap is placed over the environmentally sensitive component in order that the vulnerable component itself is protected from the external environment. The less-vulnerable remainder of the millimeter-wave module can withstand limited exposure to environmental conditions and, therefore, is not necessarily sealed.

REFERENCES:
patent: 4769272 (1988-09-01), Byrne et al.
patent: 5168344 (1992-12-01), Ehlert et al.
patent: 5596171 (1997-01-01), Harris et al.
patent: 5742007 (1998-04-01), Kornowski et al.
patent: 5750926 (1998-05-01), Schulman et al.
patent: 5804870 (1998-09-01), Burns

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