Circuit package with thermal expansion relief chimney

Details Circuit package with thermal expansion relief chimney Circuit package with thermal expansion relief chimney

1987-06-30

1988-04-19

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 52PE, 357 74, 357 81, 361395, H05K 720

Patent

active

047394498

ABSTRACT:
A circuit package (2) includes a housing (10) having a chimney (20) extending downwardly through an upper epoxy coating material (16) into a lower thermally expansible soft silicon coating material (14) which covers heat generating electrical components (8) on a ceramic substrate (4). The soft silicon coating material is pliable and subject to thermal expansion. The epoxy coating material is substantially rigid and not subject to thermal expansion. The chimney provides a thermal expansion relief passage for the soft silicon coating material upon heating thereof by the electrical components, to prevent the ceramic substrate from being pushed away from the housing by the soft silicon coating material during thermal expansion thereof, and reduce undesirable forces against internal components.

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