Circuit package with membrane, containing thermoconductive mater

Details Circuit package with membrane, containing thermoconductive mater Circuit package with membrane, containing thermoconductive mater

1983-10-31

1985-10-08

Tolin, G.P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

29832, 206330, 165185, H05K 720

Patent

active

045464103

ABSTRACT:
An electronic circuit package mountable to a heat sink is provided with burstable membrane means adhesively stuck to the circuit package and containing thermoconductive material. Upon mounting of the circuit package to the heat sink, the membrane means ruptures, and the thermoconductive material, such as silicon grease, is automatically spread along the interface of the circuit package and the heat sink to enhance heat transfer. There is no need for a manual separate step to spread the grease at the time of installation.

REFERENCES:
patent: 3958075 (1976-05-01), Kaufman
patent: 4092697 (1978-05-01), Spaight
patent: 4156148 (1979-05-01), Kaufman
patent: 4196411 (1980-04-01), Kaufman
patent: 4215235 (1980-07-01), Kaufman
patent: 4218724 (1980-08-01), Kaufman
patent: 4250481 (1981-02-01), Kaufman
patent: 4257091 (1981-03-01), Kaufman
patent: 4266140 (1981-05-01), Kaufman
patent: 4394530 (1983-07-01), Kaufman
On Board Logic . . . Printhead, Mizzi, IBM Tech. Discl. Bull., vol. 24, No. 1A, Jun. 1981, p. 284.

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