Wave transmission lines and networks – Coupling networks – Balanced to unbalanced circuits
Reexamination Certificate
2006-11-21
2006-11-21
Mai, Lam T. (Department: 2819)
Wave transmission lines and networks
Coupling networks
Balanced to unbalanced circuits
C333S033000
Reexamination Certificate
active
07138884
ABSTRACT:
In general, the invention is directed to integration of passive radio frequency (RF) structures with at least one integrated circuit in a single integrated circuit (IC) package. An IC package in accordance with the invention may include, for example, a radio IC, a digital IC, a passive radio frequency balun as well as additional passive RF structures or ICs. Additionally, passive electronic components may further be incorporated in the IC package. For example, the IC package may include a resistor, capacitor, inductor or the like. The components of the IC package may be distributed throughout layers of a multi-layer IC package, such as a multi-layer ceramic package. The different ICs and the passive RF structures may be electrically coupled via conductive traces, which may be varied in thickness and length in order to match input and output impedances of the different ICs and passive RF structures.
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Cheung Philip
Harjani Ramesh
DSP Group Inc.
Mai Lam T.
Shumaker & Sieffert P.A.
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