Circuit package for electronic systems

Details Circuit package for electronic systems Circuit package for electronic systems

2005-04-12

2005-04-12

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S720000, C361S760000, C257S773000, C257S775000, C174S261000, C174S262000

Reexamination Certificate

active

06879494

ABSTRACT:
A circuit package has been described for routing long traces between an electronic circuit, such as a phase locked loop, and external circuit components. The traces are routed through two substrates. In each substrate, the traces are routed primarily on a layer adjacent to and between a pair ground planes located close to the traces. Degassing apertures are located to the side of the long traces to avoid interfering with the shielding provided by the grounds planes. The circuit package uses two power plated through holes and two ground plated through holes to reduce the noise on the power supply lines. The circuit package also separates the signal carrying plated through holes from the power plated through holes, which reduces noise on the long traces. Noise is further reduced on the long traces by using the ground plated through holes to shield the signal carrying plated through holes from noise generated at the power plated through holes.

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Ott, Henry W., “Noise Reduction Techniques in Electronic Systems, 2nd Edition”,Copyright 1998 by AT&T Laboratories, Published by John Wiley & Sons, Inc.,(1998).

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