Circuit package cooling technique with liquid film spreading dow

Details Circuit package cooling technique with liquid film spreading dow Circuit package cooling technique with liquid film spreading dow

1987-01-12

1988-07-12

James, Andrew J.

357 74, 357 75, H01L 2504

Patent

active

047573708

ABSTRACT:
Heat producing components such as semiconductor chips are arranged with a major heat transfer surface at an angle of about 10 degrees to the vertical. A film of a dielectric liquid flows downward across this surface from a catch pan located above the component. The film evaporates and thereby removes heat from the component and the vapor is condensed and returned to the catch pan. The angle of the heat transfer surface helps to prevent separation of the film as it flows downward across the surface. In one embodiment the slanting surface is formed by slanted grooves in an otherwise vertical surface of a semiconductor chip. In other embodiments, a slanting surface or a vertical surface with slanting grooves is formed in place on the chip or is formed separately and attached to the chip or is formed as part of a local enclosure for the chip.

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