Circuit package attachment apparatus and method

Details Circuit package attachment apparatus and method Circuit package attachment apparatus and method

1986-09-02

1988-09-06

Goldberg, E. A.

Electric heating

Heating devices

Combined with diverse-type art device

228123, H05B 336

Patent

active

047695250

ABSTRACT:
A circuit package, or other device, (10) is mounted on a printed circuit board, or other substrate, (14) with an electrically conductive sinuous resistor wire structure 30 therebetween to define a space filled with adhesive. When the adhesive is set the package is held in place. When removal is desired, current is passed through the sinuous wire structure to soften the adhesive to permit removal of the package without damage to the package or the board.

REFERENCES:
patent: 1818485 (1931-08-01), Lambert
patent: 2061461 (1936-11-01), Gouhin
patent: 3289046 (1966-11-01), Carr
patent: 3660632 (1972-05-01), Leinkram
patent: 4096008 (1978-06-01), Taylor
patent: 4176274 (1979-11-01), Lipperd
patent: 4362684 (1982-12-01), Thalmann
patent: 4374316 (1983-02-01), Inamori
patent: 4436988 (1984-03-01), Blumenkranz
patent: 4529836 (1985-07-01), Powers
patent: 4650107 (1987-03-01), Keser
Ecker, M. E., "Separable Multilevel . . . ", IBM Tech. Disc. Bull., vol. 20, No. 11B, Apr. 1978, pp. 4776-4779.
Palfi, T. L. and T. S. Slater, "Selective Electrical . . . ", IBM Tech. Disc. Bull., vol. 9, No. 11, Apr. 1967, p. 1668.

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