Circuit package and method for making the same

Details Circuit package and method for making the same Circuit package and method for making the same

2005-04-26

2005-04-26

Cuneo, Kamand (Department: 2827)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S801000

Reexamination Certificate

active

06885562

ABSTRACT:
A circuit package with improved heat dissipation properties for high-power circuits. In one embodiment, the circuit package comprises two circuit boards positioned in different planes, at least one brace affixed between the two circuit boards, a molded housing enclosing an area between the circuit boards, and a plurality of electrically conductive leads extending from the sides of the circuit package. The molded housing is configured to expose at least one surface of the circuit boards to the exterior surface of the circuit package. The leads are configured in a J-shape, which allows the circuit package to be mounted in an upright position. The brace functions as a flexible spacer for holding the two circuit boards in position during the application of the molded housing. In one embodiment, a H-bridge circuit is configured on the first and second circuit boards of the circuit package.

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