Circuit pack cooling solution

Details Circuit pack cooling solution Circuit pack cooling solution

2011-04-19

2011-04-19

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S704000, C174S015200, C165S080400, C165S104260

Reexamination Certificate

active

07929306

ABSTRACT:
An improved apparatus and system are provided for heat dissipation in a bank of circuit components using heat pipes and/or vapor chambers, wherein the heat pipes and/or vapor chambers efficiently transport heat away from high heat components.

REFERENCES:
patent: 4688399 (1987-08-01), Reimann
patent: 5216580 (1993-06-01), Davidson et al.
patent: 5355942 (1994-10-01), Conte
patent: 5386143 (1995-01-01), Fitch
patent: 5409055 (1995-04-01), Tanaka et al.
patent: 6104611 (2000-08-01), Glover et al.
patent: 6118654 (2000-09-01), Bhatia
patent: 6625024 (2003-09-01), Mermet-Guyennet
patent: 6665187 (2003-12-01), Alcoe et al.
patent: 6666260 (2003-12-01), Tantoush
patent: 6675887 (2004-01-01), Garner et al.
patent: 6828675 (2004-12-01), Memory et al.
patent: 7106589 (2006-09-01), Kiley et al.
patent: 7156158 (2007-01-01), Ueda et al.
patent: 7258161 (2007-08-01), Cosley et al.
patent: 7286346 (2007-10-01), Chiba et al.
patent: 7353859 (2008-04-01), Stevanovic et al.
patent: 7447017 (2008-11-01), Koo
patent: 7448439 (2008-11-01), Hirafuji et al.
patent: 7451806 (2008-11-01), Zhou et al.
patent: 7452109 (2008-11-01), Noh et al.
patent: 7457126 (2008-11-01), Ahrens
patent: 7800907 (2010-09-01), Huang et al.
patent: 2007/0042514 (2007-02-01), Wu et al.
patent: 2008/0285236 (2008-11-01), Phillips et al.

Affiliated with

Also associated with

Rating

Circuit pack cooling solution does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit pack cooling solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit pack cooling solution will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2704801