Circuit module with pins conducting heat from floating plate con

Details Circuit module with pins conducting heat from floating plate con Circuit module with pins conducting heat from floating plate con

1987-04-14

1988-08-23

Koczo, Michael

Heat exchange

Heat transmitter

357 81, 361385, F28F 700

Patent

active

047654007

ABSTRACT:
An improved TCM-like circuit module for cooling an array of chips mounted on a substrate. The substrate and the chips are enclosed by components that include a barrier plate that separates the chip space from a coolant such as air or chilled water. A floating plate contacts a heat transfer surface of each chip and forms a local heat sink. Pins conduct heat from the floating plate. In one embodiment, one end of each pin is rigidly attached to the floating plate and the other end is located in a cavity in the barrier plate. In a second embodiment, the cavities are formed in the floating plate and the barrier plate rigidly supports the pins. In the second embodiment, the pins can be extended through the barrier plate to contact the coolant directly.

REFERENCES:
patent: 4226281 (1980-10-01), Chu
patent: 4649990 (1987-03-01), Kurihara et al.
IBM Bulletin, "High Performance Air Cooled Module", vol. 28, No. 7, Dec. 1985, pp. 3058-3059.
IBM Bulletin, "Programmable Heat Sink Device for Thermal Enhancement", Bakos et al., vol. 22, No. 3, Aug. 1979, p. 957.
IBM Bulletin, "Chip-Cooling Apparatus . . . ", vol. 28, No. 3, Aug. 1985, p. 1300.
IBM Bulletin, "Circuit Package with Spring-Loaded Pistons", vol. 28, No. 7, Dec. 1985, p. 3066.

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