Circuit module with non-contacting microwave interlayer...

Details Circuit module with non-contacting microwave interlayer... Circuit module with non-contacting microwave interlayer...

2009-05-28

2011-11-15

Takaoka, Dean (Department: 2817)

Wave transmission lines and networks

Plural channel systems

Having branched circuits

C333S238000

Reexamination Certificate

active

08058946

ABSTRACT:
A circuit module may include a first substrate having a first side and a second side, a second substrate having a third side and a fourth side, the third side facing the second side, and a resilient bond layer coupling the second side to the third side. The first substrate may have a first coefficient of thermal expansion and the second substrate may have a second coefficient of thermal expansion substantially different from the first coefficient of thermal expansion. A broadside coupler may couple a microwave signal from the first substrate to the second substrate. The broadside coupler may include a first conductive element formed on the second side and a second conductive element formed on the third side proximate the first conductive element.

REFERENCES:
patent: 3999150 (1976-12-01), Caragliano
patent: 4821007 (1989-04-01), Fields et al.
patent: 6611181 (2003-08-01), Marketkar
patent: 7034633 (2006-04-01), Passiopoulos et al.
patent: 7088201 (2006-08-01), Piernas
Rogers Corporation, Design Equations for Broadside and Edgewise Stripline Couplers, Design 3.2.1, (c) 1982-2003 Rogers Corporation, Chandler, AZ, U.S.A.
David Lacombe and Jerome Cohen, Octave-Band Microstrip DC Blocks, IEEE Transactions on Microwave Theory and Techniques, Aug. 1972, p. 555.

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