Circuit module with enhanced heat transfer and distribution

Details Circuit module with enhanced heat transfer and distribution Circuit module with enhanced heat transfer and distribution

1984-04-17

1986-12-09

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361386, 361414, H05K 720

Patent

active

046284079

ABSTRACT:
A circuit module (10) having enhanced heat transfer and distribution characteristics which is particularly adapted for use in high speed electronic digital computers. The circuit module (10) includes a circuit board assembly (12) with a plurality of electronic devices (26) such as integrated circuits, mounted on a circuit board (28). The circuit board (28) includes conductive pads (42 and 44) and plated-through holes (46) forming a thermally conductive flow path from each electronic device (26) to the opposite side of the circuit board for more efficient heat transfer away from the module (10). The heat pads (42 and 44) and plated-through holes (46) are preferably connected with the ground plane layer (36) of the circuit board (28) for better heat distribution as well.

REFERENCES:
patent: 3268772 (1966-08-01), Kamei
patent: 3904934 (1975-09-01), Martin
patent: 4054939 (1977-10-01), Ammon
patent: 4120021 (1978-10-01), Roush
patent: 4204247 (1980-05-01), Wigley
patent: 4383270 (1983-05-01), Schelhorn
A. P. Mandel et al., "Heat Dissipator Assemblies", IBM Technical Disclosure Bulletin, Mar. 1966, vol. 8, No. 10.
C. S. K. Ng, "Circuit Module Package", IBM Technical Disclosure Bulletin, Feb. '79, vol. 21, No. 9, p. 3539.
M. J. Donegan, "Thermal Connection for Circuit Package", IBM Technical Disclosure Bulletin, vol. 13, No. 7, Dec. '70.
G. O. Tiffany, "Integrated Circuit Package and Heat Sink", IBM Technical Disclosure Bulletin, vol. 13, No. 1, Jun. '70.

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