Circuit module with direct liquid cooling by a coolant flowing b

Details Circuit module with direct liquid cooling by a coolant flowing b Circuit module with direct liquid cooling by a coolant flowing b

1989-06-15

1990-05-22

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

H05K 720

Patent

active

049282077

ABSTRACT:
In an improved circuit module with a flat chip-carrying substrate and cylindrical pistons that contact the chips for cooling, each piston has an axial bore that carries a dielectric liquid to the chip and the lower face of the piston (facing the chip) is spaced away from the chip to establish radial channels that carry the liquid across the surface of the chip. The face of the piston, as seen in a section through the axis, is shaped to provide a selected flow pattern across the surface of the chip. The piston face reduces the channel height in the direction of flow where the liquid is non-boiling and thereby offsets the tendency for the flow rate to decrease as the circumferential width of the channel widens. The piston face increases the channel height in the direction of flow where the liquid is boiling to handle the increase in volume caused by the vapor. In one embodiment, the piston carries a shroud around the chip which causes the coolant to flow across the edge of the chip to provide additional chip cooling and to impinge on the nearby region of the substrate that supports the chips to remove heat that flows from the chip to the substrate.

REFERENCES:
patent: 3993123 (1986-11-01), Chu et al.
patent: 4561040 (1985-12-01), Eastman et al.
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4729060 (1988-03-01), Yamamoto et al.
patent: 4765397 (1988-08-01), Chrysler et al.
patent: 4833567 (1989-05-01), Saaski et al.
IBM Technical Disclosure Bulletin, vol. 27, No. 12, May 1985, vol. 27, No. 12, May 1985 "Thermal . . . Onto The Chip" by R. C. Chu.
IBM Technical Disclosure Bulletin, vol. 29, No. 7, Dec. 1986, "Liquid Cooled Circuit Package with Jet Impinging on Heat . . . From the Jet" by W. M. Antonetti et al.
IBM Technical Disclosure Bulletin, vol. 29, No. 11, Apr. 1987, "Thermal Conduction Module With Dielectric . . . Transfer" by R. C. Chu.

Affiliated with

Also associated with

Rating

Circuit module with direct liquid cooling by a coolant flowing b does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit module with direct liquid cooling by a coolant flowing b, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit module with direct liquid cooling by a coolant flowing b will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2138531