Circuit module including a plate-shaped circuit carrier of glass

Details Circuit module including a plate-shaped circuit carrier of glass Circuit module including a plate-shaped circuit carrier of glass

1988-05-31

1990-03-06

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165185, 174 163, 357 81, 361388, 361401, H05K 720

Patent

active

049071254

ABSTRACT:
A metal plate is connected over a large area to one side of a glass or ceramic substrate for good heat distribution and removal. The metal plate consists of three layers, namely two outer copper layers and a center Invar layer having the thickness ratio of the layers of approximately 20:60:20. As a result of such a selected thickness ratio, the metal plate exhibits approximately the same coefficient of thermal expansion as the substrate and an inadmissible bending of the substrate or overstressing of the solder or adhesive line between the substrate and metal plate is prevented.

REFERENCES:
patent: 4025997 (1977-05-01), Gernitis et al.
patent: 4648008 (1987-03-01), Neyroud et al.
patent: 4689719 (1987-08-01), Prussas et al.
"Copper-Clad Invar Heatsink", IBM Technical Disclosure Bulletin, vol. 27, No. 11, 4/85, p. 6382.

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