Circuit module having interleaved groups of circuit chips

Details Circuit module having interleaved groups of circuit chips Circuit module having interleaved groups of circuit chips

2005-07-12

2005-07-12

Ngô, Ngân V. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S724000

Reexamination Certificate

active

06917100

ABSTRACT:
A circuit module has a carrier (10) and multiple stacks of circuit chips arranged on a surface of the carrier. Each stack has multiple circuit chips arranged in different layers. The circuit chips are grouped in different groups, wherein the groups are not active at the same time. The circuit chips are arranged such that circuit chips belonging to the same group are arranged in different layers in adjacent stacks.

REFERENCES:
patent: 4587594 (1986-05-01), McPherson
patent: 5003370 (1991-03-01), Kashiwagi
patent: 6542393 (2003-04-01), Chu et al.
patent: 2002/0074639 (2002-06-01), Kim et al.
patent: 2003/0089978 (2003-05-01), Miyamoto et al.
patent: 2003/0137041 (2003-07-01), Blackshear et al.
patent: 2004/0104469 (2004-06-01), Yagi et al.
patent: WO 01/37090 (2001-05-01), None

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