Circuit module connection system

Details Circuit module connection system Circuit module connection system

1988-08-12

1989-12-05

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 803, 165185, 357 81, 361388, 361406, 361408, 361413, H05K 720, H01R 900

Patent

active

048856622

ABSTRACT:
Circuit module connection system for connection of a modular package (18) to a printed wiring board (12) has a contact (24) on the package and an aligned pad (16) on the board. A resilient contact (44) is positioned therebetween and is held in place and separated from adjacent contacts by means of contact retainer (34). The contact retainer (34) also has a seal flange (40) to resiliently seal out the environment. A thermal member (42) spaces the package from the board and permits heat flow out of the package.

REFERENCES:
patent: 3541222 (1970-11-01), Parks et al.
patent: 3616532 (1971-11-01), Beck
patent: 4050756 (1977-09-01), Moore
patent: 4581679 (1986-04-01), Smolley
patent: 4597029 (1986-06-01), Kucharek et al.
Markewycz, "Distribution System For Multilayer Ceramic Modules", IBM Technical Disclosure Bulletin, vol. 19, No. 4, pp. 1270-1271.
Gagnon et al, "Plating Through-Holes", IBM Technical Disclosure Bulletin, vol. 11, No. 12, pp. 1704-1705.

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