Circuit module and process for producing the same

Details Circuit module and process for producing the same Circuit module and process for producing the same

2008-01-17

2010-06-15

Lee, Jinhee J (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S777000, C361S760000

Reexamination Certificate

active

07738263

ABSTRACT:
A circuit module containing a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder, the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pads, and the dents being joined to the ceramic substrate pads with solder.

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patent: 2005/0057883 (2005-03-01), Bolken et al.
patent: 2005/0263878 (2005-12-01), Potter
patent: 2007/0164637 (2007-07-01), Onozawa
patent: 7-73123 (1995-08-01), None
patent: 2001-68576 (2001-03-01), None

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