Circuit module and manufacturing method thereof

Details Circuit module and manufacturing method thereof Circuit module and manufacturing method thereof

2011-08-23

2011-08-23

Nguyen, Dao H (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S118000, C438S125000, C438S329000, C257S700000, C257S703000, C257S758000, C257S778000, C257SE21511, C257SE21512, C257SE23062, C257SE23178, C257SE25023, C361S795000, C174S256000, C174S260000

Reexamination Certificate

active

08003438

ABSTRACT:
A circuit module includes an electronic component, a ceramic multilayer substrate and a resin wiring substrate. The ceramic multilayer substrate is provided with a wiring layer disposed on top thereof and a cavity in which the electronic component is mounted, wherein a space between the electronic component and the cavity is filled with a thermosetting resin and a surface of the filled cavity is planarized. The resin wiring substrate has an insulating adhesive layer disposed at one side thereof and provided with at least one opening filled with a conductive resin. The ceramic multilayer substrate and the resin wiring substrate are bonded by the insulating adhesive layer, and the wiring layer on the ceramic multilayer substrate is electrically connected with the conductive resin.

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