Circuit module and information processing apparatus

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361707, 361761, 361818, 174 152, 16510433, 165 803, H05K 720

Patent

active

060697938

ABSTRACT:
The present invention provides an information processing apparatus that may be designed in small and thin size and a small and thin CPU module that has a nigh heat releasing effect and is suitable therefor. The CPU module includes a processor, a connector to be electrically connected to the outside, a system control circuit for controlling transfer of a signal between the processor and the connector, and a printed board on which the processor, the connector and the system control circuit are mounted. The CPU module further provides a heat release plate one side of which is pasted with the printed board and the other side of which is substantially planar. The printed board has a cavity formed therein so that the processor may be fitted in the cavity in a bare-chip state. One side of the bare chip is jointed with the heat release plate.

REFERENCES:
patent: 5315482 (1994-05-01), Tanaka et al.
patent: 5557502 (1996-09-01), Banerjee et al.
patent: 5631807 (1997-05-01), Griffin
patent: 5701231 (1997-12-01), Do et al.
patent: 5710733 (1998-01-01), Chengson et al.
patent: 5712762 (1998-01-01), Webb
patent: 5847935 (1998-12-01), Thaler et al.

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