Circuit module and circuit device including circuit module

Details Circuit module and circuit device including circuit module Circuit module and circuit device including circuit module

2008-04-10

2008-11-11

Norris, Jeremy C (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S783000, C361S728000, C361S761000, C361S767000, C361S768000, C361S735000, C361S736000, C257S737000

Reexamination Certificate

active

07450395

ABSTRACT:
A circuit module includes connection electrodes on a plate-shaped board and connection electrodes on a frame-shaped board that are bonded together with conductive bonding materials there between. Circuit components are provided in portions of a surface of the plate-shaped board, the portions being located inward relative to the frame-shaped board. A sealing resin is filled and cured in a cavity, which is defined by the frame-shaped board and the plate-shaped board. Since the center of each of the connection electrodes on the frame-shaped board is inwardly displaced relative to the center of a corresponding one of the connection electrodes on the plate-shaped board by α, a curing contraction stress of the sealing resin is mitigated by a curing contraction stress of the conductive bonding materials. Thus, deformation of the frame-shaped board is suppressed.

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Official communication issued in the International Application No. PCT/JP2006/317721, mailed on Nov. 14, 2006.

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