Circuit manufacturing apparatus

Details Circuit manufacturing apparatus Circuit manufacturing apparatus

2009-11-10

2011-11-08

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S739000, C029S832000, C228S180500, C324S754100

Reexamination Certificate

active

08051555

ABSTRACT:
An assembling apparatus includes a chip transfer unit, a heating unit, a testing unit, and an output unit. The chip transfer unit mounts first semiconductor chip to a circuit board to form an electrical circuit. The heating unit heats a solder connection to electrically connect the semiconductor chip to the circuit board. The testing unit tests the semiconductor chip, and, when the testing unit determines that the first semiconductor chip is not functioning properly, the heating unit reheats the solder connection to remove the non-functioning semiconductor chip from the circuit board.

REFERENCES:
patent: 5163599 (1992-11-01), Mishina et al.
patent: 5232463 (1993-08-01), Micic et al.
patent: 5467912 (1995-11-01), Mishina et al.
patent: 6841728 (2005-01-01), Jones et al.
patent: 6878172 (2005-04-01), Jensen
patent: 7313859 (2008-01-01), Maenishi et al.
patent: 7357288 (2008-04-01), Hosotani et al.
patent: 7841079 (2010-11-01), Inoue et al.
patent: 2004/0003882 (2004-01-01), Davis et al.
patent: 2003-158328 (2003-05-01), None
patent: 1998-84030 (1998-12-01), None
patent: 2004-67048 (2004-07-01), None

Affiliated with

Also associated with

Rating

Circuit manufacturing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit manufacturing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit manufacturing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4268203