Circuit isolation technique for RF and millimeter-wave modules

Details Circuit isolation technique for RF and millimeter-wave modules Circuit isolation technique for RF and millimeter-wave modules

1998-05-18

2000-10-17

Lee, Benny

Metal working

Method of mechanical manufacture

Electrical device making

333 1, 333 12, 333246, H01P 1100

Patent

active

06131269&

ABSTRACT:
A circuit module construction and method for its fabrication, in which radio-frequency (RF) or millimeter-wave circuit components (10) are electromagnetically isolated in a circuit module (12), to allow for location of multiple circuit components in close proximity without concern for signal loss or interference between components. Multiple RF or millimeter-wave circuit components (10) are installed on a dielectric substrate (14) and are separated by at least one metal isolation wall (20), which extends in depth all the way through the dielectric substrate (14) to a metal layer (16) formed under the substrate. Each isolation wall (20) is formed by first cutting a channel through the dielectric substrate (14), preferably using a laser that selectively removes the dielectric material but not the metal layer (16). Then the channel is filled with metal by electroplating, to provide continuous electromagnetic isolation in a lateral direction, parallel to the plane of the substrate (14).

REFERENCES:
patent: 4513266 (1985-04-01), Ishihara
patent: 4870377 (1989-09-01), Brown et al.
patent: 5227749 (1993-07-01), Raguenet et al.
patent: 5426399 (1995-06-01), Matsubayashi et al.
patent: 5777526 (1998-07-01), Kawasaki
patent: 5907477 (1999-05-01), Tuttle et al.

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