Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1992-07-29
1993-09-14
Bradley, Paula A.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 67, H01R 909
Patent
active
052443957
ABSTRACT:
A circuit interconnect system comprises a circuit pattern (22) on a rigid insulating sheet (17), forming a first circuit carrying substrate (12). A portion of the circuit pattern wraps around an edge of the insulating sheet and continues onto a vertical wall (20) of the sheet to provide a contact surface (24). An electrically conductive portion (16) of a second member (14) is mated to the first circuit carrying substrate by aligning the contact surface to the electrically conductive portion. An electrically conductive resilient material such as a conductive elastomer (35) or metal spring (35) provides electrical interconnection between the circuit pattern and the electrically conductive portion.
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patent: 5101323 (1992-03-01), Prevost
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patent: 5119273 (1992-06-01), Corda
patent: 5122064 (1992-06-01), Zarreii
Albertson Peter E.
DeSantis John A.
Bradley Paula A.
Dorinski Dale W.
Motorola Inc.
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