Circuit in a selective call radio with improved electromechanica

Details Circuit in a selective call radio with improved electromechanica Circuit in a selective call radio with improved electromechanica

1998-12-21

2000-12-12

Gaffin, Jeffrey

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361749, 361764, 174254, 174260, 174262, 257734, 257737, 257735, H05K 118

Patent

active

061607134

ABSTRACT:
A SCR (Selective Call Radio) (400) includes a circuit. The circuit in turn includes a component (102) having one or more bondable elements (104-108), and a substrate (110) coupled to the component (102). To substantially improve interconnect reliability, the substrate (110) includes a corresponding one or more bondable pads (108) for interconnecting with the one or more bondable elements (104-108) of the component (102), and one or more slotted openings (202) in the substrate (110) for relieving mechanical stress near one or more interconnects of the substrate (110) and the component (102).

REFERENCES:
patent: 4814943 (1989-03-01), Okuaki
patent: 5180976 (1993-01-01), Van Loan et al.
patent: 5519332 (1996-05-01), Wood et al.
patent: 5640047 (1997-06-01), Nakashima
patent: 5777855 (1998-07-01), Yokajty
patent: 6000120 (1999-12-01), Arledge et al.
patent: 6002163 (1999-12-01), Wojnarowski
patent: 6002590 (1999-12-01), Farnworth et al.
patent: 6061246 (2000-05-01), Oh et al.
patent: 6079100 (2000-06-01), Farquhar et al.

Affiliated with

Also associated with

Rating

Circuit in a selective call radio with improved electromechanica does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit in a selective call radio with improved electromechanica, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit in a selective call radio with improved electromechanica will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-223429