Circuit housing

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S728000, C361S752000, C361S760000, C361S767000, C257S704000, C257S726000

Reexamination Certificate

active

06891730

ABSTRACT:
Miniaturized circuit housing to encapsulate and provide external contacts for at least one integrated circuit, in particular of the flip-chip or wafer-level-package type, with a housing floor, the lower surface of which bears housing contact elements for making external contact and the upper surface of which is electrically connected to circuit contact elements on the lower surface of the circuit, wherein a housing lid is provided, in particular opposite the housing floor, which presses the circuit with the circuit contact element resiliently against the upper surface of the housing floor, and between the circuit contact elements and the housing floor there is no connection that fixes their materials permanently together.

REFERENCES:
patent: 2780758 (1957-02-01), Zetwo
patent: 3299328 (1967-01-01), Martin et al.
patent: 3654529 (1972-04-01), Lord
patent: 3912525 (1975-10-01), Monneraye et al.
patent: 4415025 (1983-11-01), Horvath
patent: 4748495 (1988-05-01), Kucharek
patent: 5616520 (1997-04-01), Nishiuma et al.
patent: 5949654 (1999-09-01), Fukuoka
patent: 6020597 (2000-02-01), Kwak
patent: 6165816 (2000-12-01), Mizushima et al.
patent: 980558 (1965-01-01), None
patent: 1 246 858 (1971-09-01), None
patent: 11-185915 (1999-07-01), None

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