Circuit having trim pads formed in scribe channel

Details Circuit having trim pads formed in scribe channel Circuit having trim pads formed in scribe channel

1995-09-27

1998-01-20

Walberg, Teresa J.

Electrical resistors

Mechanically variable

Resistance value varied by removing or adding material

338320, 338203, 338325, 296101, H01L 1000

Patent

active

057105383

ABSTRACT:
In accordance with the present invention, trim pads used in trimming on-chip resistive elements are formed in the scribe channels interposed between respective dice on a wafer. Metal traces connect the trim pads to their associated resistive elements formed on the dice. Thus, each trim pad formed within the scribe channels results in a corresponding increase in the usable silicon surface area of the dice, thereby saving valuable silicon real estate.

REFERENCES:
patent: 2693023 (1954-11-01), Kerridge et al.
patent: 3930304 (1976-01-01), Keller et al.
patent: 3983528 (1976-09-01), King
patent: 4150366 (1979-04-01), Price
patent: 4199745 (1980-04-01), Barry
patent: 4201970 (1980-05-01), Onyshkevych
patent: 4228418 (1980-10-01), Piedmont et al.
patent: 4378549 (1983-03-01), Szware
patent: 4486738 (1984-12-01), Sadlo et al.
patent: 4610079 (1986-09-01), Abe et al.
patent: 5015989 (1991-05-01), Wohlfarth
patent: 5059899 (1991-10-01), Farnworth
patent: 5493148 (1996-02-01), Ohata et al.
Nickel, D.J., "Element Trimming Fusible Lind" IBM Technical Disclosure Bulletin, V.26, No. 8, 1984.

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