Circuit-formed substrate and method of manufacturing...

Details Circuit-formed substrate and method of manufacturing... Circuit-formed substrate and method of manufacturing...

2008-04-15

2008-04-15

Norris, Jeremy C (Department: 2841)

Metal working

Method of mechanical manufacture

Electrical device making

C174S262000, C428S901000

Reexamination Certificate

active

07356916

ABSTRACT:
A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to and not more than 1.5 times of a thickness of the reinforcing member.

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“Remarkable Development Trend of Buildup Multilayer PWB” by Kiyoshi Takagi, Surface-Mount Technology, published by The Nikkan Kogyo Shimbun, Ltd., 1997, pp. 2-10, with partial English translation.

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