Circuit formation part and manufacturing method for this...

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener

Reexamination Certificate

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C427S306000, C427S316000, C427S322000, C427S431000, C427S443100, C204S157610

Reexamination Certificate

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10467338

ABSTRACT:
The insulating layer formation step of forming an insulating layer24-1on a base for resin application20by applying polymeric material, which has been diluted with a solvent, filled with inorganic filler to the base for resin application and by drying the base for resin application; the circuit formation portion forming step of creating a circuit formation portion and a via hole25in insulating layer24-1that has been formed in the above described insulating layer formation step by means of a laser treatment; and the circuit formation step of forming a circuit23-1by plating the circuit formation portion and via hole25that have been created in the above described circuit formation portion forming step are provided and the insulating layer formation step, the circuit formation portion forming step and the circuit formation step are repeated a plurality of times in this order and, thereby, a circuit formation part (multi-layered substrate) is manufactured. Accordingly, a multi-layered circuit, even of more than three layers, having an arbitrary circuit formation can easily be manufactured at a low cost.

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