Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – For fault location
Reexamination Certificate
2009-01-26
2011-10-04
Valone, Thomas (Department: 2858)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
For fault location
C324S523000, C324S527000
Reexamination Certificate
active
08030943
ABSTRACT:
The solder-joint integrity of digital electronic packages, such as FPGAs or microcontrollers that have internally connected input/output buffers, is evaluated by applying a time-varying voltage through one or more solder-joint networks to charge a charge-storage component. Each network includes an I/O buffer on the die in the package and a solder-joint connection, typically one or more such connections inside the package and between the package and a board. The time constant for charging the component is proportional to the resistance of the solder-joint network, hence the voltage across the charge-storage component is a measurement of the integrity of the solder-joint network.
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Hofmeister James P
Spuhler Philipp S.
Vermeire Bert M
Gifford Eric A.
Ridgetop Group, Inc.
Valone Thomas
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