Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
1999-06-29
2001-07-03
Karlsen, Ernest (Department: 2858)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S765010, C365S201000, C714S733000
Reexamination Certificate
active
06255835
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates generally to an option function test apparatus for a semiconductor memory device, and more particularly to an option function test apparatus for a semiconductor memory device which can test previously on-chip functions in a state of a wafer before when the functions are classified into each device' specifications, upon mass-production of the functions each mounted according to each device' specification.
2. Description of the Prior Art
Generally, an asynchronous memory device can be classified into an extended data output(EDO) mode, a fast page(FP) mode and a self refresh mode, wherein a function selector is used to discriminate the operation modes.
However, as the conventional semiconductor memory device cannot test previously all the functions already mounted, in a state of a wafer, before a process is proceeded according to the specification of a set operation mode, it usually employs fuse option or metal option, or bonding option etc. to selectively test the functions. However, in case of bonding option, though the conventional method can easily test the functions using the already-mounted multifunction check, there is a problem that it has to perform a bonding for selecting the specification before the testing, thus requiring an additional cost. The additional cost may include the cost related to lead frame or assembly.
Also, in case of fuse option, though the conventional method can easily test the functions using the already-mounted multifunction check, there is a problem that it has to perform a fuse blowing for selecting the specification before the testing, thus requiring an additional cost.
Similarly, in case of metal option, though the conventional method can easily test the functions using the already-mounted multifunction check, there is a problem that it requires an additional mask manufacturing for selecting the specification before the testing.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide an option function test apparatus for a semiconductor memory device comprising a function selection means which can test previously all the functions in a state of a wafer before a process is proceeded according to the specifications of operation mode each set such as a fuse option and a metal option, and a bonding option etc.
In order to accomplish the above object, the option functions test apparatus of a semiconductor device according to the present invention including a function selecting means, wherein the function selection means includes a fuse signal detecting section for sensing the state of fuse blowing, a pad signal detecting section for sensing the signal state on the probe pad for selecting its specification, which is consisted by incorporating extra probe chips into the existing probe card, and a global signal control section for receiving the output signals from said fuse signal detecting section and said pad signal detecting section to output different output signals based on its operation mode.
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Chung Jin Yong
Oh Young Nam
Hyundai Electronics Industries Co,. Ltd.
Karlsen Ernest
Pennie & Edmonds LLP
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